Parameter Table
| Application Area | Classification | Product Name |
|---|---|---|
| IC | Formulated Chemicals | Mirror thinning on the back side of the wafer |
| Atomization and thinning of the wafer backside | ||
| Etching of polysilicon and silicon substrates | ||
| Oxide etching and wafer cleaning | ||
| Metal film etching | ||
| Nitrogen-silicon/oxy-silicon isokinetic etching | ||
| Selective etching of indium gallium zinc oxide | ||
| Selective etching of nitrogen-silicon/oxy-silicon | ||
| SiN/AlO, selective etching of SiN/TiN | ||
| Phosphoric acid additives, CMP abrasives | ||
| A new generation of HK material etching fluids | ||
| Etching of molybdenum | ||
| Etching of Sc-AlN-doped | ||
| Selective etching of SiGe | ||
| The back side of the wafer is thinned and highly doped silicon is selectively etched | ||
| In etching, the selection ratio of silicon oxide to silicon nitride etching is more than 200 | ||
| In etching, the etching selection ratio of silicon oxide to aluminum is more than 50 | ||
| Etching fluids can infiltrate deep trenches to etch the silica media they deposit to a specific depth | ||
| Gate silicon oxide can be etched and has good uniformity | ||
| Photoresist diluent | ||
| Control bezel wafer regeneration | ||
| Dry etching residue removal | ||
| Dry etching residue cleaning in aluminum process (>130nm) | ||
| Dry etching residue cleaning in copper process (130nm-40nm) | ||
| Copper process: dry etching residue cleaning with TiN hard mask (40nm-12nm) | ||
| It is used for 10nm process AlOx cleaning and removal | ||
| Lift-off process light resistance removal | ||
| Lift-off process light resistance removal |
Product Description
Formulated Chemicals are commonly used in a variety of ways in the manufacture of integrated circuits and display panels. Some common uses include:
Formulated Chemicals can be used to prepare photoresists to define fine structures on circuit boards or display panels. These chemicals play a key role in the photolithography process, helping to create precise patterns and structures.
Formulated Chemicals are used in manufacturing processes to clean and remove residues, such as organic and inorganic residues generated during production.
Some Formulated Chemicals can be used in a variety of chemical reactions and deposition processes, such as preparing functional layers with specific conductivity or optical properties.
Formulated Chemicals can also be used to ensure product quality and consistency, for example by controlling surface treatments and process conditions.
When working with Formulated Chemicals, safe operating procedures must be strictly followed and handling and disposal must be carried out in an appropriate environment.
In the electronic component manufacturing process, IC grade chemicals usually have the following requirements:
IC grade chemicals must be of extremely high purity to ensure that no impurities or contaminants are introduced during the manufacturing process. These chemicals must be produced to strict purity requirements and undergo stringent purification and testing procedures.
IC grade chemicals must have low ionic residue as high ion content may negatively impact the performance of electronic components. Therefore, steps are often taken during the production process to minimize ionic carryover.
IC-grade chemicals must have low residue content to avoid leaving any impurities during the manufacturing process that would affect circuit performance or stability.
IC-grade chemicals must have stable chemical properties, and their composition must be strictly controlled and confirmed to ensure that they meet the requirements during the manufacturing process.
The production and use of IC-grade chemicals must comply with relevant industry standards and regulations to ensure product quality and safety.
When using Class IC chemicals, manufacturers typically strictly control their sources, adopt appropriate storage and handling practices, and ensure operators are appropriately trained.